www.clare.com

4

CPC1302

R01

MECHANICAL DIMENSIONS

PC Board Pattern

(Top View)

8-0.800 DIA.

(8-0.031 DIA.)

2.540 ± 0.127

(0.100 ± 0.005)

7.620 ± 0.127

(0.300 ± 0.005)

7.620 ± 0.127

(0.300 ± 0.005)

6.350 ± 0.127

(0.250 ± 0.005)

PC Board Pattern

(Top View)

2.540 ± 0.127

(0.100 ± 0.005)

8.305 ± 0.127

(0.327 ± 0.005)

1.905 ± 0.127

(0.075 ± 0.005)

1.498 ± 0.127

(0.059 ± 0.005)

7.239 TYP.

(0.285)

3.302

(0.130)

9.144 TYP.

(0.360)

8-Pin DIP Through Hole (Standard)

7.620 ± 0.254

(0.300 ± 0.010)

2.540 ± 0.127

(0.100 ± 0.005)

6.350 ± 0.127

(0.250 ± 0.005)

8.077 ± 0.127

(0.318 ± 0.005)

9.144 ± 0.508

(0.360 ± 0.020)

0.457 ± 0.076

(0.018 ± 0.003)

9.652 ± 0.381

(0.380 ± 0.015)

3.302

(0.130)

0.254 TYP.

(0.010)

0.635 TYP.

(0.025)

8-Pin Surface Mount (“S” Suffix)

4.445 ± 0.127

(0.175 ± 0.005)

7.620 ± 0.254

(0.300 ± 0.010)

2.540 ± 0.127

(0.100 ± 0.005)

9.652 ± 0.381

(0.380 ± 0.015)

6.350 ± 0.127

(0.250 ± 0.005)

9.525 ± 0.254

(0.375 ± 0.010)

0.457 ± 0.076

(0.018 ± 0.003)

8.077 ± 0.127

(0.318 ± 0.005)

Manufacturing Information

Soldering

For proper assembly, the component must be

processed in accordance with the current revision

of IPC/JEDEC standard J-STD-020. Failure to

follow the recommended guidelines may cause

permanent damage to the device resulting in impaired

performance and/or a reduced lifetime expectancy.

Washing

Clare does not recommend ultrasonic cleaning or the

use of chlorinated solvents.

Dimensions:

mm

(inches)