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SPECIFICATION

SYSTEM

Processor

i.MX 93 applications processor

MIMX9352CVVXMAB, Dual core, 1.7GHz, NPU, -40°C~105°C

Memory

2GB LPDDR4 Memory Down

GRAPHICS

Controller

2D Graphics: PXP Engine

Feature

Blending/Composition, Resize, Color Space Conversion

Display

1 x HDMI 1.4

1 x LVDS

HDMI: resolution up to 1920x1080 @60Hz

LVDS: resolution up to 1366x768 @60Hz

Single Display

LVDS or HDMI

STORAGE

eMMC

1 x eMMC 5.1 with default 16GB (up to 64GB)

EXPENSION

Interface

1 x M.2 B key 3042 (USB 2.0)

1 x Nano SIM slot

ETHERNET

Phy

RTL8211

REAR I/O

Ethernet

2 x GbE (RJ-45)

Serial

1 x RS485 (2-wire)

USB

2 x USB 2.0

1 x Micro USB 2.0 (OTG)

Display

1 x HDMI

Download Mode

Switch

1 x Download mode switch

INTERNAL I/O

Serial

1 x RS232, 1x RS232/422/485 on 2x6 header

USB

2 x USB 2.0

Display

1 x LVDS LCD Panel connector (Default: 12V/Opt.: 5V)

1 x LCD Backlight Power (Default: 5V/Opt.: 3.3V)

SD

1 x uSD card

DIO

1 x 8-bit DIO

I2C

1 x I2C / Touch

CANBus

1 x CAN bus 2.0b

Camera

1 x MIPI-CSI for 2-lanes camera, reference to RPI-CAM-MIPI Camera adapter (AR0144 Sensor)

Others

1 x SPI, 1 x Front Panel, 1 x UART debug

WATCHDOG TIMER

Output & Interval

System Reset, Programmable via Software from 1 to 255 Seconds

POWER

Type

Wide Range 9~36VDC

Connector

2-pole terminal block

Consumption

Typical: 9V @ 0.28A (2.52Watt); 36V @ 0.10A (3.60Watt)

Max.: 9V @ 0.36A (3.24Watt); 36V @ 0.11A (3.96Watt)

RTC Battery

CR2032 Coin Cell

OS SUPPORT

Linux

Linux Yocto 4.2 (Kernel 6.1.36)

ENVIRONMENT

Temperature

Operating: -5°C ~ 65°C, -40°C~85°C

Storage: -40°C ~ 85°C

Humidity

Operating: 5% ~ 90% RH

Storage: 5% ~ 90% RH

MTBF

MIMX9352CVVXMAB, Dual core: 778,719 hrs @ 25°C;

497,925 hrs @ 45°C ; 331,500 hrs @ 60°C; 247,941 hrs @ 70°C

Calculation model: Telcordia Issue 4

Environment: GB, GC – Ground Benign, Controlled

MECHANISM

Dimensions

2.5" SBC Form Factor

100mm (3.94") x 72mm (2.83")

Height

PCB: 1.6mm

Top Side: TBC

Bottom Side: TBC

STANDARDS AND

CERTIFICATIONS

Certifications

CE, FCC, RoHS, UKCA

DFI reserves the right to change the specifications at any time prior to the product's release. Changes thereafter will be based on the product's revision. Please contact your

sales representative for the exact revision offered in your area. All product names mentioned are trademarks of their respective companies. © January 9, 2025 DFI Inc.

PACKING LIST

OPTIONAL ITEMS

1 M93053 board

1 Terminal block for RS485 (COM3)

342-361021-000G

1 Heat spreader (Height: 11mm)

A71-808354-000G

2 pole terminal to DC jack cable

A81-004013-000G

Power adapter (60W, 12V, DC Jack)

671-106012-000G

USB 2.0 cable (Length: 200mm)

A81-001084-016G

COM port cable (Length: 250mm, COM4/5 port)

A81-015088-016G

Debug console with cable (Length: 500mm)

770-IMX8M1-000G

Heat sink (Height: 17.7mm)

A71-008358-000G

ORDERING INFORMATION

Model Name

P/N

Processor Memory eMMC GbE RS-485 RS-232 RS-232/422/485 USB 2.0

Power Thermal

Temp.

M93053-BCC-2152 770-M930531-000G

Dual core

2 GB

16 GB

2

1

1

1

5

9~36VDC Fanless

-5°C~65°C

M93053-ECC-2152 770-M930531-100G

-40°C~85°C