M41T256YMT7F datasheet(26/30 Pages) STMICROELECTRONICS

26 / 30 page

Package mechanical data

M41T256Y

26/30

Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Figure 15.

SOH44 – 44-lead plastic small outline, SNAPHAT, package outline

Note:

Drawing is not to scale.

Table 11.

SOH44 – 44-lead plastic small outline, SNAPHAT, package mech. data

SOH-A

Symb

inches

Typ

Min

Max

Typ

Min

Max

3.05

0.120

0.05

0.36

0.002

0.014

2.34

2.69

0.092

0.106

0.36

0.46

0.014

0.018

0.15

0.32

0.006

0.012

17.71

18.49

0.697

0.728

8.23

8.89

0.324

0.350

e0.81–

–

0.032

–

3.20

3.61

0.126

0.142

11.51

12.70

0.453

0.500

0.41

1.27

0.016

0.050

a0°

8°

0°

8°

N44

0.10

0.004

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