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74ALVC374 Scheda tecnica(PDF) 14 Page - NXP Semiconductors |
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74ALVC374 Scheda tecnica(HTML) 14 Page - NXP Semiconductors |
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14 / 17 page ![]() 74ALVC374_2 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 02 — 17 October 2007 14 of 17 NXP Semiconductors 74ALVC374 Octal D-type flip-flop; positive-edge trigger; 3-state Fig 13. Package outline SOT764-1 (DHVQFN20) terminal 1 index area 0.5 1 A1 Eh b UNIT y e 0.2 c REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 4.6 4.4 Dh 3.15 2.85 y1 2.6 2.4 1.15 0.85 e1 3.5 0.30 0.18 0.05 0.00 0.05 0.1 DIMENSIONS (mm are the original dimensions) SOT764-1 MO-241 - - - - - - 0.5 0.3 L 0.1 v 0.05 w 0 2.5 5 mm scale SOT764-1 DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 20 terminals; body 2.5 x 4.5 x 0.85 mm A(1) max. A A1 c detail X y y1 C e L Eh Dh e e1 b 29 19 12 11 10 1 20 X D E C B A terminal 1 index area A C C B v M w M E(1) Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. D(1) 02-10-17 03-01-27 |
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