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AS1326

Data Sheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in Electrical Character-

istics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Table 3. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

ON, ONN, OUT, CLK/SEL to GND

-0.3

7

V

PGND to GND

-0.3

+0.3

V

REF, FB, ISET, POUT to GND

-0.3

0.3

V

LX to PGND

-0.3

0.3

V

POUT to OUT

-0.3

+0.3

V

Thermal Resistance

33

ºC/W

on PCB

Operating Temperature Range

-40

+85

ºC

Storage Temperature Range

-65

+150

ºC

Junction Temperature

+150

ºC

Package Body Temperature

+260

ºC

The reflow peak soldering temperature (body

temperature) specified is in accordance with

IPC/JEDEC J-STD-020C “Moisture/Reflow

Sensitivity Classification for Non-Hermetic Solid

State Surface Mount Devices”.

The lead finish for Pb-free leaded packages is

matte tin (100% Sn).