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MMA7455LR2 Scheda tecnica(PDF) 23 Page - Freescale Semiconductor, Inc |
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MMA7455LR2 Scheda tecnica(HTML) 23 Page - Freescale Semiconductor, Inc |
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23 / 27 page  Sensors Freescale Semiconductor 23 MMA7455L Figure 20. Incorrect PCB Top Metal Pattern Under Package Figure 21. Correct PCB Top Metal Pattern Under Package Figure 22. Recommended PCB Land Pad, Solder Mask, and Signal Trace Near Package Design Figure 23. Stencil Design Guidelines Example of 2 layer PCB Top metal pattern under package area Via structure under LGA package w/ solder PCB top metal layer 0.8 mm 0.5 mm Package PCB land pattern - Cu: 0.9 x 0.6 mm sq. Signal trace near package: 0.1mm width and min. 0.5mm length are recommended. Wider trace can be continued after these. Wider trace SM opening = PCB land pad + 0.1mm = 1.0 x 0.7mm sq. 0.575m 0.625m Stencil openings for 4 corner pads are bigger than others, Refer to next drawing. Package footprint Signal trace near package |
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