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STDRIVEG611Q Scheda tecnica(PDF) 21 Page - STMicroelectronics |
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STDRIVEG611Q Scheda tecnica(HTML) 21 Page - STMicroelectronics |
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21 / 33 page ![]() 6.7 Thermal shutdown The STDRIVEG611 provides a thermal shutdown protection feature. When, during active mode, the junction temperature reaches the TTSD temperature threshold, the device turns the driver outputs off to leaves the half-bridge in 3-state and signals this condition forcing the FLT pin low. The status of all the input pins is ignored. When the junction temperature is lower than TTSD-THYS, the device operation is restored and the FLT pin is released. Figure 16. Thermal shutdown behavior TJ TTSD THYS LIN OUTL FLT STBY TJ TTSD THYS HIN OUTH FLT STBY The overtemperature detection is inactive when the device is operating in standby mode or in VCC UVLO to minimize consumption. On standby mode exit or VCC UVLO exit, overtemperature requires tTSD to protect against overtemperature. Figure 17. Thermal shutdown vs. standby TJ TTSD THYS LIN/HIN OUTL/OUTH FLT STBY tTSD STATUS ACTIVE OVERTEMP. ACTIVE OVERTEMP. STANDBY ACTIVE OT STDRIVEG611 Device description DS14457 - Rev 2 page 21/33 |
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