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Rev.1.6.Nov.14, 2019

AX6646/A



ABSOLUTE MAXIMUM RATINGS (at TA=25°C)

Characteristics

Symbol

Rating

Unit

VIN Pin Voltage

VIN

GND - 0.3 to + 6.5

V

Output Voltage

VOUT

GND - 0.3 to VIN + 0.3

V

EN Pin Voltage

VEN

GND - 0.3 to + 6.5

V

FB Pin Voltage

VFB

GND - 0.3 to + 6.5

V

Power Dissipation

PD

400

mW

Storage Temperature Range

TST

-40 to +150

°C

Operating Junction Temperature

TJ

-40 to +125

°C

Thermal Resistance from Junction to case

θJC

180

°C/W

Thermal Resistance from Junction to ambient

θJA

250

°C/W

Note : θJA is measured with the PCB copper area of approximately 1 in2(Multi-layer).



ELECTRICAL CHARACTERISTICS (VIN=5V, TA=25°C unless otherwise noted)

Characteristics

Symbol

Conditions

Min

Typ

Max Units

Input Voltage

VIN

(Note1)

2.6

-

6

V

FB Voltage

VFB VIN=2.6V to 6V, IOUT=1mA 0.784 0.8

0.816

V

FB Input Leakage Current

IFB

VFB=1.0V

-100

-

100

nA

Adjustable Output Voltage

Range

VOUT

VFB

-

5.5

V

Quiescent Current

IQ

IOUT =0mA, VIN=5V

-

40

60

μA

Shutdown Current

ISD

VIN=3.6V, VEN=0V

-

-

1

μA

Dropout Voltage (Note 2)

VDROP IOUT=300mA, VOUT＞2.7V

-

0.2

0.3

V

Current Limit (Note 3)

ILIMIT

400

600

-

mA

Short Circuit Current

Ishort VOUT < 0.25*VOUT

-

250

-

mA

Load Regulation (Note 4)

ΔVLOAD IOUT=10m~300mA

-

-

0.02 %/mA

Ripple Rejection

PSRR

CIN=1μF

COUT=1uF

IOUT =100mA

F=120Hz

-

65

-

dB

F=1KHz

-

60

-

Enable Input Threshold

VENH Regulator Enable

2.0

-

-

V

VENL Regulator Shutdown

-

-

0.4

Enable Pin Current

IENH VEN=VIN

-

0.003

0.1

μA

IENL VEN=0V, VIN=3.6V

-

0.35

1

Thermal Shutdown

TSD

-

150

-

ºC

Thermal Shutdown

Hysterics

TSH

-

30

-

ºC

Note 1: Minimum VIN voltage is defined by output adds a dropout voltage.

Note 2: The dropout voltage is defined as (VIN-VOUT), the performance of every AX6646/A part, see “Typical

Performance Characteristics”.

Note 3: Current limit is measured at constant junction temperature by using pulsed testing with a low ON time.

Note 4: Regulation is measured at constant junction temperature by using pulsed testing with a low ON time.