STR750FV1 datasheet(79/84 Pages) STMICROELECTRONICS

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Package characteristics

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6.2

Thermal characteristics

The maximum chip junction temperature (TJmax) must never exceed the values given in

Table 10: General operating conditions on page 34.

The maximum chip-junction temperature, TJmax, in degrees Celsius, may be calculated

using the following equation:

TJmax = TAmax + (PDmax x ΘJA)

Where:

–TAmax is the maximum Ambient Temperature in °C,

–

ΘJA is the Package Junction-to-Ambient Thermal Resistance, in ° C/W,

–PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax),

–PINTmax is the product of IDD and VDD, expressed in Watts. This is the maximum

chip internal power.

–PI/Omax represents the maximum Power Dissipation on Output Pins.

Where:

PI/Omax = Σ (VOL*IOL) + Σ((VDD-VOH)*IOH),

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high

level in the application.

6.2.1

Reference document

JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural

Convection (Still Air). Available from www.jedec.org

Table 48.

Thermal characteristics(1)

Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection

environment.

Symbol

Parameter

Value

Unit

ΘJA

Thermal Resistance Junction-Ambient

LQFP 100 - 14 x 14 mm / 0.5 mm pitch

°C/W

ΘJA

Thermal Resistance Junction-Ambient

LQFP 64 - 10 x 10 mm / 0.5 mm pitch

°C/W

ΘJA

Thermal Resistance Junction-Ambient

LFBGA 64 - 8 x 8 x 1.7mm

°C/W

ΘJA

Thermal Resistance Junction-Ambient

LFBGA 100 - 10 x 10 x 1.7mm

°C/W

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