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STR750FV2 Scheda tecnica(PDF) 78 Page - STMicroelectronics |
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STR750FV2 Scheda tecnica(HTML) 78 Page - STMicroelectronics |
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78 / 84 page ![]() Package characteristics STR750Fxx STR751Fxx STR752Fxx STR755Fxx 78/84 Figure 48. 100-ball low profile fine pitch ball grid array package Figure 49. Recommended PCB design rules (0.80/0.75mm pitch BGA) Dim. mm inches(1) 1. Values in inches are converted from mm and rounded to 4 decimal digits. Min Typ Max Min Typ Max A 1.700 0.0669 A1 0.270 0.0106 A2 1.085 0.0427 A3 0.30 0.0118 A4 0.80 0.0315 b 0.45 0.50 0.55 0.0177 0.0197 0.0217 D 9.85 10.00 10.15 0.3878 0.3937 0.3996 D1 7.20 0.2835 E 9.85 10.00 10.15 0.3878 0.3937 0.3996 E1 7.20 0.2835 e 0.80 0.0315 F 1.40 0.055 ddd 0.12 0.005 eee 0.15 0.006 fff 0.08 0.003 Number of Balls N 100 Dpad Dsm Dpad 0.37 mm Dsm 0.52 mm typ. (depends on solder mask registration tolerance Solder paste 0.37 mm aperture diameter – Non solder mask defined pads are recommended – 4 to 6 mils screen print |
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