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TLP1243 Scheda tecnica(PDF) 8 Page - Toshiba Semiconductor |
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TLP1243 Scheda tecnica(HTML) 8 Page - Toshiba Semiconductor |
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8 / 9 page ![]() TLP1243(C8) 2007-10-01 8 Relative Positioning of Shutter and Device For normal operation, position the shutter and the device as shown in the figure below. By considering the device’s detection direction characteristic and switching time, determine the shutter slit width and pitch. Unit: mm Thickness of Metal Board a Dimension b Dimension 1.0 11.7 min 8.9 max 1.2 11.5 min 8.7 max 1.6 11.1 min 8.3 max Recommended Size of Connection Holes (Unit: mm) 1.0-mm thick metal board 1.2-mm thick metal board 1.6-mm thick metal board 6.65 ± 0.1 6.65 ± 0.1 6.65 ± 0.1 Shutter Metal board A A’ Center of sensor Cross section between A and A' |
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