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ACT88430 Scheda tecnica(PDF) 39 Page - Qorvo, Inc

Il numero della parte ACT88430
Spiegazioni elettronici  Advanced PMU for Microcontrollers and Solid State Drive Applications
PDF  74 Pages
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Produttore elettronici  QORVO [Qorvo, Inc]
Homepage  https://www.qorvo.com/
Logo QORVO - Qorvo, Inc

ACT88430 Scheda tecnica(HTML) 39 Page - Qorvo, Inc

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Data Sheet Rev. G, August 2021 | Subject to change without notice
39 of 74
www.qorvo.com
© 2020 Qorvo US, Inc. All rights reserved. Confidential
ACT88430
Advanced PMU for Microcontrollers and Solid State Drive Applications
®
PC BOARD LAYOUT GUIDANCE
Proper parts placement and PCB layout are critical to
the operation of switching power supplies. Follow the
following
layout
guidelines
when
designing
the
ACT88430 PCB. Refer to the Qorvo ACT88430
Evaluation Kits for layout examples
1.
Place the buck input capacitors as close as possible
to the IC. Connect the capacitors directly to the
corresponding VIN_Bx input pin and PGNDx power
ground pin. Avoid the use of vias if possible.
2.
Minimize the switch node trace length between
each SW_Bx pin and the inductor. Avoid routing
sensitive analog signals near these high frequency,
high dV/dt traces.
3.
Place the LDO input capacitors close to their input
pins. Connect their ground pins into the ground
plane that connects the IC’s exposed pad.
4.
The input capacitor and output capacitor grounds
should be connected as close together as possible,
with short, direct, and wide traces.
5.
Connect the PGNDx ground pins and the AGND
ground pin directly to the exposed pad under the IC.
The AGND
ground
plane
should
be
routed
separately from the other ground planes and only
connect to the main ground plane under the IC at
the AGND pin.
6.
Connect the VIO_IN input capacitor to the AGND
ground pin.
7.
Connect the VIN input capacitor to the AGND
ground pin.
8.
Remember that all open drain outputs need pullup
resistors.
9.
Connect the exposed pad directly the top layer
ground plane. Connect the top layer ground plane
to both internal ground planes and the PCB back-
side ground plane with thermal vias. Provide ground
plane routing on multiple layers that allows the IC’s
heat to flow into the PCB and then spread radially
from the IC. Avoid cutting the ground planes and
adding
vias
that
restrict
the
radial
flow
of
heat of operating conditions, and are relatively in-
sensitive to layout considerations.



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