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ACT88430 Scheda tecnica(PDF) 39 Page - Qorvo, Inc |
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ACT88430 Scheda tecnica(HTML) 39 Page - Qorvo, Inc |
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39 / 74 page ![]() Data Sheet Rev. G, August 2021 | Subject to change without notice 39 of 74 www.qorvo.com © 2020 Qorvo US, Inc. All rights reserved. Confidential ACT88430 Advanced PMU for Microcontrollers and Solid State Drive Applications ® PC BOARD LAYOUT GUIDANCE Proper parts placement and PCB layout are critical to the operation of switching power supplies. Follow the following layout guidelines when designing the ACT88430 PCB. Refer to the Qorvo ACT88430 Evaluation Kits for layout examples 1. Place the buck input capacitors as close as possible to the IC. Connect the capacitors directly to the corresponding VIN_Bx input pin and PGNDx power ground pin. Avoid the use of vias if possible. 2. Minimize the switch node trace length between each SW_Bx pin and the inductor. Avoid routing sensitive analog signals near these high frequency, high dV/dt traces. 3. Place the LDO input capacitors close to their input pins. Connect their ground pins into the ground plane that connects the IC’s exposed pad. 4. The input capacitor and output capacitor grounds should be connected as close together as possible, with short, direct, and wide traces. 5. Connect the PGNDx ground pins and the AGND ground pin directly to the exposed pad under the IC. The AGND ground plane should be routed separately from the other ground planes and only connect to the main ground plane under the IC at the AGND pin. 6. Connect the VIO_IN input capacitor to the AGND ground pin. 7. Connect the VIN input capacitor to the AGND ground pin. 8. Remember that all open drain outputs need pullup resistors. 9. Connect the exposed pad directly the top layer ground plane. Connect the top layer ground plane to both internal ground planes and the PCB back- side ground plane with thermal vias. Provide ground plane routing on multiple layers that allows the IC’s heat to flow into the PCB and then spread radially from the IC. Avoid cutting the ground planes and adding vias that restrict the radial flow of heat of operating conditions, and are relatively in- sensitive to layout considerations. |
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