TDA7406 datasheet(62/64 Pages) STMICROELECTRONICS

62 / 64 page

Package information

TDA7406

62/64

Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Figure 32. TQFP44 Mechanical Data & Package Dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

1.60

0.063

0.05

0.15

0.002

0.006

1.35

1.40

1.45

0.053

0.055

0.057

0.30

0.37

0.45

0.012

0.015

0.018

0.09

0.20

0.004

0.008

11.80

12.00

12.20

0.464

0.472

0.480

9.80

10.00

10.20

0.386

0.394

0.401

8.00

0.315

11.80

12.00

12.20

0.464

0.472

0.480

9.80

10.00

10.20

0.386

0.394

0.401

8.00

0.315

0.80

0.031

0.45

0.60

0.75

0.018

0.024

0.030

1.00

0.039

0˚(min.), 3.5˚(typ.), 7˚(max.)

TQFP44 (10 x 10 x 1.4mm)

Seating Plane

TQFP4410

0.10mm

.004

0076922 D

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