AS5510 datasheet(6/31 Pages) AMSOSRAM

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[v1-07] 2015-Feb-27

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AS5510 − Absolute Maximum Ratings

Stresses beyond those listed in Absolute Maximum Ratings may

cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other

conditions beyond those indicated in Electrical Characteristics is

not implied. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability.

Figure 6:

Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

DC supply voltage at pin VDD

-0.3

Input pin voltage

-0.3

VDD+0.3

Input current (latchup immunity)

-100

100

Norm: JEDEC 78

Electrostatic discharge

±2

Norm: MIL 883 E method 3015

Storage temperature

-55

125

°C

Body temperature (Lead-free

package) for WLCSP

TBody

260

°C

The reflow peak soldering temperature

(body temperature) specified is in

accordance with IPC/ JEDEC J-STD-020

“Moisture/Reflow Sensitivity

Classification for Non-Hermetic Solid

State Surface Mount Devices”.

Body temperature (Lead-free

package) for SOIC8

260

Relative Humidity non-condensing

Moisture Sensitivity Level for WLCSP

Represents a max. floor life time of

unlimited

Moisture Sensitivity Level for SOIC8

Absolute Maximum Ratings

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