Soldering Profile

Tp

Tsmax

25

Time 25 °C to Peak

Time

TL

Tc -5 °C

tp

tL

MAX. RAMP UP RATE = 3 °C/SEC.

MAX. RAMP DOWN RATE = 6 °C/SEC.

PREHEAT AREA

Tsmin

ts

REFLOW TIMES: 3 TIMES MAX.

Profile Feature

Pb Free Assembly

Preheat

- Temperature Min. (Tsmin)

- Temperature Max. (Tsmax)

- Time(ts) from Tsmin to Tsmax

150 °C

200 °C

60-120 seconds

Ramp-up Rate (TL to Tp)

3 °C/second max.

Liquidous temperature (TL)

Time (tL) maintained above TL

217 °C

60-150 seconds

Reflow temperature

260 °C

Time (tp) at Tc - 5 °C

(Tp should be equal to or less than Tc)

< 30 seconds

Ramp-Down Rate (Tp to TL)

6 °C/second max.

Time 25 °C to Peak Temperature

8 minutes max.

CWF1610A Series – 0603 Chip Inductors

Specifications are subject to change without notice.

Users should verify actual device performance in their specific applications.

The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.

Typical Curves

FREQUENCY (MHz)

100

10

1

0.1

0.01

220

5R6

3R3

R56

R10

1

10

100

1000

FREQUENCY (MHz)

100

10

1

R56

3R3

220

5R6

1

10

1000

100

R10

Inductance vs. Frequency

Q vs. Frequency