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FS32K112BFT0M Scheda tecnica(PDF) 32 Page - NXP Semiconductors

Il numero della parte FS32K112BFT0M
Spiegazioni elettronici  NXP Semiconductors
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Produttore elettronici  NXP [NXP Semiconductors]
Homepage  http://www.nxp.com
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System Clock Generation (SCG) specifications
6.2.3.1 Fast internal RC Oscillator (FIRC) electrical specifications
Table 19. Fast internal RC Oscillator electrical specifications
Symbol
Parameter1
Value
Unit
Min.
Typ.
Max.
FFIRC
FIRC target frequency
—
48
—
MHz
ΔF
Frequency deviation across process, voltage, and
temperature < 105°C
—
±0.5
±1
%FFIRC
ΔF125
Frequency deviation across process, voltage, and
temperature < 125°C
—
±0.5
±1.1
%FFIRC
TStartup
Startup time
3.4
5
µs2
TJIT, 3
Cycle-to-Cycle jitter
—
300
500
ps
TJIT3
Long term jitter over 1000 cycles
—
0.04
0.1
%FFIRC
1. With FIRC regulator enable
2. Startup time is defined as the time between clock enablement and clock availability for system use.
3. FIRC as system clock
NOTE
Fast internal RC oscillator is compliant with LIN when device
is used as a slave node.
6.2.3.2 Slow internal RC oscillator (SIRC) electrical specifications
Table 20. Slow internal RC oscillator (SIRC) electrical specifications
Symbol
Parameter
Value
Unit
Min.
Typ.
Max.
FSIRC
SIRC target frequency
—
8
—
MHz
ΔF
Frequency deviation across process, voltage, and
temperature < 105°C
—
—
±3
%FSIRC
ΔF125
Frequency deviation across process, voltage, and
temperature < 125°C
—
—
±3.3
%FSIRC
TStartup
Startup time
—
9
12.5
µs1
1. Startup time is defined as the time between clock enablement and clock availability for system use.
6.2.3
System Clock Generation (SCG) specifications
S32K1xx Data Sheet, Rev. 11, 06/2019
32
NXP Semiconductors



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