BGA2803

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© NXP Semiconductors N.V. 2015. All rights reserved.

Product data sheet

Rev. 5 — 13 July 2015

2 of 18

NXP Semiconductors

BGA2803

MMIC wideband amplifier

3.

Ordering information

4.

Marking

5.

Limiting values

6.

Thermal characteristics

7.

Characteristics

Table 2.

Ordering information

Type number

Package

Name

Description

Version

BGA2803

-

plastic surface-mounted package; 6 leads

SOT363

Table 3.

Marking

Type number

Marking code

Description

BGA2803

MB*

* = - : made in Hong Kong

* = p : made in Hong Kong

* = W : made in China

* = t : made in Malaysia

Table 4.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

VCC

supply voltage

RF input AC coupled

0.5

+5.0

V

ICC

supply current

-

55

mA

Ptot

total power dissipation

Tsp = 90 C-

200

mW

Tstg

storage temperature

40

+125

C

Tj

junction temperature

-

125

C

Pdrive

drive power

-

+10

dBm

Table 5.

Thermal characteristics

Symbol

Parameter

Conditions

Typ

Unit

Rth(j-sp)

thermal resistance from junction to

solder point

Ptot = 200 mW; Tsp =90 C

300

K/W

Table 6.

Characteristics

VCC = 3.3 V; ZS = ZL = 50 ; Pi = 30 dBm; Tamb = 25 C; measured on demo board; unless otherwise specified.

Symbol Parameter

Conditions

Min

Typ

Max

Unit

VCC

supply voltage

2.7

3.0

3.3

V

ICC

supply current

5.0

5.8

6.6

mA