www.ti.com

PACKAGE OUTLINE

C

4.1

3.9

4.1

3.9

0.8

0.7

0.05

0.00

2X 1.95

12X 0.65

2X 1.95

16X

0.5

0.3

16X

0.35

0.25

2.6 0.1

(DIM A) TYP

WQFN - 0.8 mm max height

RUM0016A

PLASTIC QUAD FLATPACK - NO LEAD

4214998/A 11/2021

DIM A

OPT 1

OPT 2

0.2

0.1

0.08 C

0.1

C A B

0.05

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

PIN 1 INDEX AREA

SEATING PLANE

PIN 1 ID

(45 X 0.3)

SYMM

EXPOSED

THERMAL PAD

SYMM

1

4

5

8

9

12

13

16

17

SCALE 3.000

A

B