LMP8350

SNOSB80C – FEBRUARY 2011 – REVISED OCTOBER 2015

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6.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2)

±2500

Electrostatic

V(ESD)

Charged-device model (CDM), per JEDEC specification JESD22-C101(3)

±1250

V

discharge

Machine Model

±200

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions.

(2)

Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of

JEDEC). Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).

(3)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

See

(1)

MIN

MAX

UNIT

Temperature range (TA)

–40

85

°C

Supply voltage (VS = V

+ – V–)

4.5

12

V

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics Tables.

6.4 Thermal Information

LMP8350

THERMAL METRIC(1)

D (SOIC)

UNIT

8 PINS

RθJA

Junction-to-ambient thermal resistance (2)

150

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board.

4

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