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Motore di ricerca datesheet componenti elettronici |
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Motore di ricerca datesheet componenti elettronici |
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LOP476 Scheda tecnica(PDF) 11 Page - OSRAM GmbH |
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LOP476 Scheda tecnica(HTML) 11 Page - OSRAM GmbH |
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11 / 17 page  LO P476, LY P476 2007-08-07 11 Empfohlenes Lötpaddesign 8) Seite 17 IR Reflow Löten, montage von unten Recommended Solder Pad 8) page 17 IR Reflow Soldering, reverse mount Empfohlenes Lötpaddesign 8) Seite 17 IR Reflow Löten, montage von oben Recommended Solder Pad 8) page 17 IR Reflow Soldering, top mount OHAY1307 Hole in PCB Solder resist Lötstoplack (ø2.1 (0.083) 2.6 (0.102) 3.6 (0.142) (0.5 (0.020)) +0.1 (0.004) Padgeometrie für verbesserte Wärmeableitung Paddesign for improved heat dissipation Bauteil positioniert, Rückseite Component location on pad, backside ) OHAY2629 Lötstoplack Solder resist ø2.3 (0.091) 2.6 (0.102) 0.7 (0.028) No solder resist; no copper pad Kein Lötstoplack; kein Kupfer |
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