5 Specifications

5.1 Absolute Maximum Ratings(1)

MIN

MAX

UNIT

VCC

DC supply voltage

-0.5

7

V

IIK

DC input diode current

For VI < -0.5 V or VI > VCC

+ 0.5 V

±20

mA

IOK

DC output diode current

For VO < -0.5 V or VO >

VCC + 0.5

±20

mA

IO

DC drain current, per output

For -0.5 V < VO < VCC +

0.5 V

±35

mA

IO

DC output source or sink current per output pin

For VO > -0.5 V or VO <

VCC + 0.5 V

±25

mA

ICC

DC VCC or ground current

±50

mA

TJ

Maximum junction temperature

150

℃

Tstg

Maximum storage temperature range

-65

150

℃

Maximum lead temperature (soldering 10s)SOIC - lead tips

only

300

℃

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

5.2 Operating Conditions

MIN

MAX

UNIT

VCC

Supply voltage range

HC Types

2

6

V

HCT Types

4.5

5.5

V

VI, VO

DC input or output voltage

0

VCC

V

Input rise and fall time

2 V

1000

ns

4.5 V

500

6 V

400

TA

Temperature range

-55

125

℃

5.3 Thermal Information

THERMAL METRIC

N (PDIP)

D (SOIC)

UNIT

16 PINS

16 PINS

RθJA

Junction-to-ambient thermal resistance

(1)

67

73

°C/W

(1)

The package thermal impedance is calculated in accordance with JESD 51 - 7

CD54HC365, CD74HC365, CD54HCT365

CD74HCT365, CD54HC366, CD74HC366

SCHS180D – NOVEMBER 1997 – REVISED JULY 2022

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