STA2058

Package information

17/20

5

Package information

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Figure 6.

LQFP64 mechanical data and package dimensions

OUTLINE AND

MECHANICAL DATA

A

A2

A1

C

16

17

32

33

48

49

64

D3

D1

D

e

1

K

TQFP64

Seating Plane

0.08mm

DIM.

mm

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

A

1.60

0.063

A1

0.05

0.15

0.002

0.006

A2

1.35

1.40

1.45

0.053

0.055

0.057

B

0.17

0.22

0.27

0.20

0.0066 0.0086 0.0106

0.0079

C

0.09

0.0035

D

11.80

12.00

12.20

0.464

0.472

0.480

D1

9.80

10.00

10.20

0.386

0.394

0.401

D3

7.50

0.295

e

0.50

0.0197

E

11.80

12.00

12.20

0.464

0.472

0.480

E1

9.80

10.00

10.20

0.386

0.394

0.401

E3

7.50

0.295

L

0.45

0.60

0.75

0.0177 0.0236 0.0295

L1

1.00

0.0393

K

0˚ (min.), 3.5˚ (min.), 7˚(max.)

ccc

0.080

0.0031

LQFP64 (10 x 10 x 1.4mm)

0051434 F

ccc