Motore di ricerca datesheet componenti elettronici
  Italian  ▼
ALLDATASHEETIT.COM

X  

Preview PDF HTML

SY75608 Scheda tecnica(PDF) 37 Page - Microchip Technology

Il numero della parte SY75608
Spiegazioni elettronici  8 or 12 Output Ultra-Low Additive Jitter
PDF  44 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Produttore elettronici  MICROCHIP [Microchip Technology]
Homepage  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

SY75608 Scheda tecnica(HTML) 37 Page - Microchip Technology

Back Button SY75608 Datasheet HTML 33Page - Microchip Technology SY75608 Datasheet HTML 34Page - Microchip Technology SY75608 Datasheet HTML 35Page - Microchip Technology SY75608 Datasheet HTML 36Page - Microchip Technology SY75608 Datasheet HTML 37Page - Microchip Technology SY75608 Datasheet HTML 38Page - Microchip Technology SY75608 Datasheet HTML 39Page - Microchip Technology SY75608 Datasheet HTML 40Page - Microchip Technology SY75608 Datasheet HTML 41Page - Microchip Technology Next Button
Zoom Inzoom in Zoom Outzoom out
 37 / 44 page
background image
2021 - 2023 Microchip Technology Inc. and its subsidiaries
DS20006363D-page 37
SY75608/612
RECOMMENDED LAND PATTERN
Dimension Limits
Units
C2
Optional Center Pad Width
Contact Pad Spacing
Optional Center Pad Length
Contact Pitch
Y2
X2
4.25
4.25
MILLIMETERS
0.50 BSC
MIN
E
MAX
7.90
Contact Pad Length (X56)
Contact Pad Width (X56)
Y1
X1
0.85
0.30
NOM
1
2
56
C1
0
9
.
7
g
n
i
c
a
p
S
d
a
P
t
c
a
t
n
o
C
Contact Pad to Contact Pad (X52)
G2
0.20
Thermal Via Diameter
V
Thermal Via Pitch
EV
0.33
1.20
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Contact Pad to Center Pad (X56)
G1
0.85
Microchip Technology Drawing C04-27665 Rev A
C1
C2
EV
EV
Y2
X2
X1
G2
SILK SCREEN
E
Y1
G1
ØV
56-Lead Very Thin Plastic Quad Flat, No Lead Package (K3C) - 8x8x1.0 mm Body [VQFN]
With 4.15 mm Exposed Pad



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44


Scheda tecnica Scarica

Go To PDF Page


Link URL



Lei ha avuto il aiuto da alldatasheet?  [ DONATE ] 

Di alldatasheet   |   Richest di pubblicita   |   contatti   |   Privacy Policy   |   Collegamento alla scheda tecnica    |   scambio Link   |   Ricerca produttore
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com