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Motore di ricerca datesheet componenti elettronici |
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Motore di ricerca datesheet componenti elettronici |
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TOP245P Scheda tecnica(PDF) 49 Page - Power Integrations, Inc. |
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TOP245P Scheda tecnica(HTML) 49 Page - Power Integrations, Inc. |
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49 / 52 page  TOP242-250 49 M 12/04 .165 (4.19) .185 (4.70) R07C TO-263-7C PI-2664-122004 -A- LD #1 .580 (14.73) .620 (15.75) .390 (9.91) .420 (10.67) .326 (8.28) .336 (8.53) .055 (1.40) .066 (1.68) .100 (2.54) REF 0.68 (1.73) MIN .208 (5.28) Ref. .024 (0.61) .034 (0.86) .225 (5.72) MIN .245 (6.22) MIN .000 (0.00) .010 (0.25) .010 (0.25) .090 (2.29) .110 (2.79) .012 (0.30) .024 (0.61) °8 -°0 .045 (1.14) .055 (1.40) .050 (1.27) Notes: 1. Package Outline Exclusive of Mold Flash & Metal Burr. 2. Package Outline Inclusive of Plating Thickness. 3. Foot Length Measured at Intercept Point Between Datum A Lead Surface. 4. Controlling Dimensions are in Inches. Millimeter Dimensions are shown in Parentheses. 5. Minimum metal to metal spacing at the package body for the omitted pin locations is .068 in. (1.73 mm). .004 (0.10) .315 (8.00) .128 (3.25) .038 (0.97) .050 (1.27) .380 (9.65) .638 (16.21) Solder Pad Dimensions |
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