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LM7332MA/NOPB Scheda tecnica(PDF) 25 Page - Texas Instruments

Il numero della parte LM7332MA/NOPB
Spiegazioni elettronici  LM7332 Dual Rail-to-Rail Input and Output 30-V, Wide Voltage Range, High Output, Operational Amplifier
PDF  37 Pages
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Produttore elettronici  TI2 [Texas Instruments]
Homepage  https://www.ti.com
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LM7332MA/NOPB Scheda tecnica(HTML) 25 Page - Texas Instruments

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TEMPERATURE (°C)
Operating area
Ma
xi
mu
m
the
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l ca
pa
bili
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(SO
IC
)
Ma
ximu
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ility
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(MSO
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LM7332
www.ti.com
SNOSAV4B – APRIL 2008 – REVISED JANUARY 2016
Figure 54 shows the power capability vs temperature for VSSOP and SOIC packages. The area under the
maximum thermal capability line is the operating area for the device. When the device works in the operating
area where PTOTAL is less than PD(MAX), the device junction temperature will remain below 150°C. If the
intersection of ambient temperature and package power is above the maximum thermal capability line, the
junction temperature will exceed 150°C, and this must be strictly prohibited.
Figure 54. Power Capability vs Temperature
When high power is required and ambient temperature cannot be reduced, providing air flow is an effective
approach to reduce thermal resistance therefore to improve power capability.
Copyright © 2008–2016, Texas Instruments Incorporated
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