TLV760

IN

OUT

GND

COUT

CIN

VIN = 6.5 V

VOUT = 5 V

0.1 µF

0.1 µF

Copyright © 2017, Texas Instruments Incorporated

12

TLV760

SNVSAV1A – JUNE 2017 – REVISED OCTOBER 2017

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Application Information (continued)

TLV760 integrates a rugged protection where the TJ is limited to 150°C. The maximum power dissipation

depends on the ambient temperature and can be calculated using PD = (TJ – TA) / RθJA, for example, substituting

the absolute maximum junction temperature, 150°C for TJ, 50°C for TA, and 275.2 °C/W for RθJA, the maximum

power that can be dissipated is 363 mW. More power can be safely dissipated at lower ambient temperatures.

Less power can be safely dissipated at higher ambient temperatures. The power dissipation can be increased by

3.6 mW for each °C below 50°C ambient. It must be derated by 3.6 mW for each °C above 50°C ambient. Proper

heat sinking enables the safe dissipation of more power.

8.2 Typical Application

Figure 18. Typical Appication for the 5-V Option

8.2.1 Design Requirements

For typical TLV760 applications, use the parameters in Table 1.

Table 1. Design Parameters

DESIGN PARAMETER

EXAMPLE VALUE

Input voltage

6.5 V

Output voltage

5 V

Output current

100 mA

8.2.2 Detailed Design Procedure

The output for TLV76050 is internally set to 5 V. Input and output capacitors can be selected in accordance with

the External Capacitors. Ceramic capacitances of 0.1 µF for both input and output are selected.

See the Layout section for an example of how to PCB layout the TLV760 to achieve best performance.