HIP2103, HIP2104

8. General EPAD Heatsinking Considerations

FN8276 Rev.2.0

Page 26 of 30

Feb 25, 2021

8.

General EPAD Heatsinking Considerations

The EPAD of the HIP2103 and HIP2104 is electrically connected to VSS through the IC substrate. The EPAD has

two main functions:

• To provide a quiet signal ground

• To provide heat sinking for the IC

The EPAD must be connected to a ground plane and switching currents from the driven FETs should not pass

through the ground plane under the IC.

Figure 28 is a PCB layout example of how to use vias to remove heat from the IC through the EPAD.

For maximum heatsinking, it is recommended that a ground plane, connected to the EPAD, is added to both sides

of the PCB. A via array within the area of the EPAD conducts heat from the EPAD to the GND plane on the bottom

layer. The number of vias and the size of the GND planes required for adequate heatsinking is determined by the

power dissipated by the HIP2103 and HIP2104, the air flow, and the maximum temperature of the air around the

IC.

Note that a separate plane is added under the high side drive circuits and is connected to HS. In a manner similar

to the ground plane, the HS plane provides the lowest possible parasitic inductance for the HO/HS gate drive

current loop.

See AN1899 “HIP2103 and HIP2104 3-phase, Full, or Half Bridge Motor Driver” for an example of PCB layout of

a real application.

VDD

EPAD GND

Plane

Component

Layer

HI

LI

LS

HB

HO

HS

LO

EPAD GND

Plane

Bottom

Layer

VDD

HI

LI

LS

HB

HO

HS

LO

This plane is

connected to

HS and is under

all high side

driver circuits

Figure 28. Typical PCB Pattern for Thermal Vias