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INA200, INA201, INA202

SBOS374E – NOVEMBER 2006 – REVISED SEPTEMBER 2017

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Copyright © 2006–2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

This voltage may exceed the ratings shown if the current at that pin is limited to 5 mA.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage, Vs

2.7

18

V

Current-shunt monitor

analog inputs, VIN+, VIN–

Differential (VIN+) – (VIN–)

–18

18

V

Common-mode(2)

–16

80

V

Comparator analog input and reset pins(2)

GND – 0.3

(Vs) + 0.3

V

Analog output, OUT(2)

GND – 0.3

(Vs) + 0.3

V

Comparator output, OUT(2)

GND – 0.3

18

V

Input current into any pin(2)

5

mA

Operating temperature

–55

150

°C

Junction temperature

–65

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±4000

V

Charged device model (CDM), per JEDEC specification JESD22-C101, all

pins(2)

±1000

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCM

Common-mode input voltage

–16

12

80

V

VS

Operating supply voltage

2.7

12

18

V

TA

Operating free-air temperature

–40

25

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

INA20x

UNIT

D (SOIC)

DGK (SOIC)

8 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

110.5

162.2

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

50.4

37.7

°C/W

RθJB

Junction-to-board thermal resistance

52.7

82.9

°C/W

ψJT

Junction-to-top characterization parameter

7.8

1.3

°C/W

ψJB

Junction-to-board characterization parameter

51.9

81.4

°C/W