www.ti.com

EXAMPLE BOARD LAYOUT

0.05 MIN

0.05 MAX

80X (

0.25)

(0.5) TYP

(0.5) TYP

(

0.25)

SOLDER MASK

OPENING

(

0.25)

METAL

(

2.8)

(

0.2) VIA

TYP

(1.15)

(1.15)

4224877/A 03/2019

TLGA - 0.9 mm max height

NPP0080A

THIN LAND GRID ARRAY

NOTES: (continued)

4. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.

See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009).

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

SOLDER MASK DETAILS

NOT TO SCALE

SYMM

SYMM

C

1

2

3

4

5

6

7

8

9

10

11

12

A

B

D

E

F

G

H

J

K

L

M

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE: 15X

NON-SOLDER MASK

DEFINED

(PREFERRED)

EXPOSED

METAL

SOLDER MASK

OPENING

SOLDER MASK

DEFINED

METAL UNDER

SOLDER MASK

EXPOSED

METAL