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LM5109A

SNVS412C – APRIL 2006 – REVISED SEPTEMBER 2016

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Copyright © 2006–2016, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 3

6.1

Absolute Maximum Ratings ...................................... 3

6.2

ESD Ratings.............................................................. 4

6.3

Recommended Operating Conditions ....................... 4

6.4

Thermal Information .................................................. 4

6.5

Electrical Characteristics........................................... 4

6.6

Switching Characteristics .......................................... 5

6.7

Typical Performance Characteristics ........................ 6

7

Detailed Description .............................................. 8

7.1

Overview ................................................................... 8

7.2

Functional Block Diagram ......................................... 8

7.3

Feature Description................................................... 8

7.4

Device Functional Modes.......................................... 9

8

Application and Implementation ........................ 10

8.1

Application Information............................................ 10

8.2

Typical Application ................................................. 11

9

Power Supply Recommendations ...................... 15

10

Layout................................................................... 16

10.1

Layout Guidelines ................................................. 16

10.2

Layout Example .................................................... 16

11

Device and Documentation Support ................. 17

11.1

Documentation Support ........................................ 17

11.2

Receiving Notification of Documentation Updates 17

11.3

Community Resource............................................ 17

11.4

Trademarks ........................................................... 17

11.5

Electrostatic Discharge Caution ............................ 17

11.6

Glossary ................................................................ 17

12

Mechanical, Packaging, and Orderable

Information ........................................................... 17

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision B (March 2016) to Revision C

Page

•

Updated values in the Thermal Information table to align with JEDEC standards................................................................. 4

•

Added Overview section. ........................................................................................................................................................ 8

•

Added Feature Description section. ....................................................................................................................................... 8

•

Added Device Functional Modes section. .............................................................................................................................. 9

•

Added Typical Application section........................................................................................................................................ 11

•

Added Power Supply Recommendations section. .............................................................................................................. 15

Changes from Revision A (March 2013) to Revision B

Page

•

Added Device Information table, ESD Ratings, Pin Configuration and Functions section, Detailed Description

section, Application and Implementation section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section. ................................................................................................ 1

Changes from Original (March 2013) to Revision A

Page

•

Changed layout of National Semiconductor Data Sheet to TI format .................................................................................. 10