6.4 Thermal Information

THERMAL METRIC(1)

DWV (SOIC)

UNIT

8 PINS

RθJA

Junction-to-ambient thermal resistance

110.1

°C/W

RθJC(top) Junction-to-case (top) thermal resistance

51.7

°C/W

RθJB

Junction-to-board thermal resistance

66.4

°C/W

ΨJT

Junction-to-top characterization parameter

16.0

°C/W

ΨJB

Junction-to-board characterization parameter

64.5

°C/W

RθJC(bot) Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Power Ratings

PARAMETER

TEST CONDITIONS

VALUE

UNIT

PD

Maximum power dissipation (both sides)

VDD1 = VDD2 = 5.5 V

99

mW

PD1

Maximum power dissipation (high-side)

VDD1 = 3.6 V

31

mW

VDD1 = 5.5 V

54

PD2

Maximum power dissipation (low-side)

VDD2 = 3.6 V

26

mW

VDD2 = 5.5 V

45

AMC1301

SBAS667G – APRIL 2016 – REVISED APRIL 2023

www.ti.com

6

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