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DAC80504 Scheda tecnica(PDF) 47 Page - Texas Instruments |
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DAC80504 Scheda tecnica(HTML) 47 Page - Texas Instruments |
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47 / 50 page ![]() www.ti.com PACKAGE OUTLINE C 3.15 2.85 3.15 2.85 0.8 0.7 0.05 0.00 2X 1.5 12X 0.5 2X 1.5 16X 0.5 0.3 16X 0.30 0.18 0.8 0.1 (0.2) TYP WQFN - 0.8 mm max height RTE0016D PLASTIC QUAD FLATPACK - NO LEAD 4219118/A 11/2018 0.08 C 0.1 C A B 0.05 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. PIN 1 INDEX AREA SEATING PLANE PIN 1 ID SYMM EXPOSED THERMAL PAD SYMM 1 4 5 8 9 12 13 16 17 SCALE 4.000 A B |
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