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VN610SP Scheda tecnica(PDF) 19 Page - STMicroelectronics |
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VN610SP Scheda tecnica(HTML) 19 Page - STMicroelectronics |
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19 / 26 page ![]() VN610SP Package and PCB thermal data Doc ID 6236 Rev 5 19/26 4 Package and PCB thermal data 4.1 PowerSO-10 thermal data Figure 21. PowerSO-10 PC board Note: Layout condition of Rth and Zth measurements (PCB FR4 area = 58mm x 58mm, PCB thickness = 2mm, Cu thickness = 35µm, Copper areas: from minimum pad-lay-out to 8cm2). Figure 22. Rthj-amb Vs PCB copper area in open box free air condition 30 35 40 45 50 55 02 4 68 10 PCB Cu heatsink area (cm^2) RTHj_amb (°C/W) Tj-Tamb=50°C Obsolete Product(s) - Obsolete Product(s) |
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