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L4979MD Scheda tecnica(PDF) 16 Page - STMicroelectronics |
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L4979MD Scheda tecnica(HTML) 16 Page - STMicroelectronics |
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16 / 22 page ![]() Package and PCB thermal data L4979D-E, L4979MD 16/22 DS3717 Rev 12 Figure 10. Rthj-amb vs PCB copper area in open box free air condition Figure 11. SO-20 thermal impedance junction ambient single pulse 50 52 54 56 58 60 62 64 66 68 70 01234567 PCB Cu heatsink area (cm^2) RTHj_ambvs Cu heatsink area RTHjamb GAPGCFT00211 1 10 100 0.0001 0.001 0.01 0.1 1 10 100 ZTH (°C/W) Time (s) Cu=6 cm2 Cu=foot print GAPGCFT00212 |
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