STM32L151VDT6D datasheet(9/154 Pages) STMICROELECTRONICS

9 / 154 page

DocID022027 Rev 11

9/154

STM32L151xD STM32L152xD

List of figures

Figure 46.

LQFP64, 10 x 10 mm, 64-pin low-profile quad flat package outline . . . . . . . . . . . . . . . . . 136

Figure 47.

LQFP64, 10 x 10 mm, 64-pin low-profile quad flat package

recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137

Figure 48.

LQFP64 10 x 10 mm, 64-pin low-profile quad flat package top view example . . . . . . . . . 138

Figure 49.

UFBGA132, 7 x 7 mm, 132-ball ultra thin, fine-pitch ball grid array package outline . . . . 139

Figure 50.

UFBGA132, 7 x 7 mm, 132-ball ultra thin, fine-pitch ball grid array package

recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140

Figure 51.

UFBGA132, 7 x 7 mm, 132-ball ultra thin, fine-pitch ball grid array package

top view example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141

Figure 52.

WLCSP64, 0.4 mm pitch wafer level chip scale package outline . . . . . . . . . . . . . . . . . . . 142

Figure 53.

WLCSP64, 0.4 mm pitch wafer level chip scale package

recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143

Figure 54.

WLCSP64, 0.4 mm pitch wafer level chip scale package top view example . . . . . . . . . . 144

Figure 55.

Thermal resistance suffix 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146

Figure 56.

Thermal resistance suffix 7

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146

STM32L151VDT6D Scheda tecnica(PDF) 9 Page - STMicroelectronics