www.ti.com

PACKAGE OUTLINE

C

SEE TERMINAL

DETAIL

28X

0.30

0.18

2.55 0.1

28X

0.5

0.3

1 MAX

(0.2) TYP

0.05

0.00

24X 0.5

2X

3.5

2X 2.5

3.55 0.1

A

4.1

3.9

B

5.1

4.9

0.30

0.18

0.5

0.3

VQFN - 1.0 mm max height

RHF0028A

PLASTIC QUAD FLATPACK - NO LEAD

4220383/A 11/2016

PIN 1 INDEX AREA

0.08 C

SEATING PLANE

1

8

15

22

9

14

28

23

(OPTIONAL)

PIN 1 ID

0.1

C A B

0.05

EXPOSED

THERMAL PAD

29

SYMM

SYMM

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SCALE 3.000

DETAIL

OPTIONAL TERMINAL

TYPICAL