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LM76005 Scheda tecnica(PDF) 49 Page - Texas Instruments |
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LM76005 Scheda tecnica(HTML) 49 Page - Texas Instruments |
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49 / 51 page ![]() www.ti.com EXAMPLE BOARD LAYOUT 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND 30X (0.25) 22X (0.75) ( 0.2) TYP VIA (R0.05) TYP (1.14) TYP (5.8) (3.65) (0.5) TYP (1.8) (0.65) TYP (4.5) 8X (0.6) (0.57) WQFN - 0.8 mm max height RNP0030G PLASTIC QUAD FLATPACK - NO LEAD 4229347/A 01/2023 SYMM 1 11 12 15 16 26 27 30 SYMM LAND PATTERN EXAMPLE SCALE:15X 31 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED METAL SOLDER MASK OPENING SOLDER MASK DETAILS NON SOLDER MASK DEFINED (PREFERRED) |
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