LM393DGKR.A datasheet(5/56 Pages) TI2

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5.3 Thermal Information: LMx93x and LM2903x

THERMAL METRIC(1)

LMx93x, LM2903x

UNIT

(SOIC)

(PDIP)

(TSSOP)

DGK

(VSSOP)

DDF

(SOT-23)

DSG

(WSON)

PINS

RθJA

Junction-to-ambient thermal resistance

148.5

114.9

200.6

193.7

197.9

96.9

°C/W

RθJC(top) Junction-to-case (top) thermal resistance

90.2

93.8

89.6

82.9

119.2

119.0

°C/W

RθJB

Junction-to-board thermal resistance

91.8

77.7

131.3

115.5

115.4

63.1

°C/W

ψJT

Junction-to-top characterization parameter

38.5

60.4

22.1

20.8

19.4

12.4

°C/W

ψJB

Junction-to-board characterization parameter

91.1

76.7

129.6

113.9

113.7

63.0

°C/W

RθJC(bot) Junction-to-case (bottom) thermal resistance

37.8

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics report.

5.4 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

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LM393B, LM2903B, LM193, LM293, LM293A, LM393, LM393A, LM2903, LM2903V

SLCS005AH – OCTOBER 1979 – REVISED APRIL 2025

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