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LMKDB1108FS Scheda tecnica(PDF) 87 Page - Texas Instruments |
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LMKDB1108FS Scheda tecnica(HTML) 87 Page - Texas Instruments |
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87 / 95 page ![]() www.ti.com EXAMPLE STENCIL DESIGN 20X (0.6) 20X (0.2) 16X (0.4) (2.8) (2.8) 4X ( 0.75) (0.47) (0.47) TYP (R0.05) TYP VQFN - 1 mm max height REY0020B PLASTIC QUAD FLATPACK - NO LEAD 4229745/A 06/2023 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 21 SYMM TYP METAL SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL EXPOSED PAD 21: 78% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:20X SYMM 1 5 6 10 11 15 16 20 |
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