STPS5L60 datasheet(4/16 Pages) STMICROELECTRONICS

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1.1

Characteristics (curves)

Figure 1. Average forward power dissipation versus

average forward current

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

δ = 0.05

δ = 0.1

δ = 0.2

δ = 0.5

δ = 1

PF(AV)(W)

IF(AV)(A)

360°

δ= tp/T

Figure 2. Average forward current versus ambient

temperature (δ = 0.5)

100

125

150

DO-201AD / SMC

PF(AV)(W)

360°

δ= tp/T

Tamb(°C)

Rth(j-a) = Rth(j-l)

SMB

Figure 3. Normalized avalanche power derating versus

pulse duration (Tj = 125 °C)

(tp)

(10 µs)

ARM

0.001

0.01

0.1

100

1000

t (µs)

Figure 4. Relative variation of thermal impedance junction

to lead versus pulse duration (SMB)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

Zth(j-l)/Rth(j-l)

360°

tP(s)

SMB

Single pulse

Figure 5. Relative variation of thermal impedance junction

to ambient versus pulse duration (DO-201AD)

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

0.0

Zth(j-a)/Rth(j-a)

tP(s)

DO-201AD

Single pulse

Figure 6. Relative variation of thermal impedance junction

to ambient versus pulse duration (SMC)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

Zth(j-a)/Rth(j-a)

360°

tP(s)

SMC

Single pulse

STPS5L60

Characteristics (curves)

DS2741 - Rev 5

page 4/16

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