OPA830 datasheet(40/63 Pages) TI2

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11 Layout

11.1 Layout Guidelines

The OPA835 EVM (SLOU314) can be used as a reference when designing the circuit board. TI recommends

following the EVM layout of the external components near to the amplifier, ground plane construction, and power

routing as closely as possible. General guidelines are listed below:

1. Signal routing must be direct and as short as possible into an out of the op amp.

2. The feedback path must be short and direct avoiding vias if possible, especially with G = +1.

3. Ground or power planes must be removed from directly under the negative input and output pins of the

amplifier.

4. TI recommends placing a series output resistor as close to the output pin as possible. See Figure 7-41 for

recommended values for the expected capacitive load.

5. A 2.2-µF power-supply decoupling capacitor must be placed within two inches of the device and can be

shared with other op amps. For split supply, a capacitor is required for both supplies.

6. A 0.1-µF power-supply decoupling capacitor must be placed as close to the supply pins as possible,

preferably within 0.1 inch. For split supply, a capacitor is required for both supplies.

7. The PD pin uses TTL logic levels. If the pin is not used, it must tied to the positive supply to enable the

amplifier. If the pin is used, it must be actively driven. A bypass capacitor is not necessary, but is used for

robustness in noisy environments.

OPA835, OPA2835

SLOS713J – JANUARY 2011 – REVISED MARCH 2021

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OPA830 Scheda tecnica(PDF) 40 Page - Texas Instruments