STPS340S datasheet(5/19 Pages) STMICROELECTRONICS

5 / 19 page

Figure 7. Relative variation of thermal impedance junction

to ambient versus pulse duration (SMC)

tp(s)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

/ R

th(j-a)

Single pulse

Figure 8. Relative variation of thermal impedance junction

to case versus pulse duration (DPAK)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

Zth(j-c)/Rth(j-c)

Single pulse

1.E-03

1.E-02

1.E-01

1.E+00

tp(s)

Figure 9. Reverse leakage current versus reverse voltage

applied (typical values)

IR(mA)

1.E-04

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

Tj=150°C

Tj=125°C

Tj=100°C

Tj=75°C

Tj=25°C

VR(V)

Figure 10. Junction capacitance versus reverse voltage

applied (typical values)

C(pF)

100

1000

1 0

100

F=1MHz

= 30mV

T= 25°C

OSC

R MS

VR(V)

Figure 11. Forward voltage drop versus forward current

IF(A)

0.01

0.10

1.00

10.00

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

Tj=25°C

(Maximum values)

Tj=125°C

(Typical values)

Tj=125°C

(Typical values)

Tj=125°C

(Maximum values)

VF(V)

Figure 12. Thermal resistance junction to ambient versus

copper surface under each lead (SMA Flat Notch)

100

150

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

(°C/W)

th(j-a)

S(Cu)(cm²)

Epoxy printed circuit board FR4, copper thickness: 35 µm

SMA Flat Notch

STPS340

Characteristics (curves)

DS0792 - Rev 13

page 5/19

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