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PACKAGE OUTLINE

C

20X

0.30

0.18

2.05 0.1

20X

0.5

0.3

1.0

0.8

(0.2) TYP

0.05

0.00

14X 0.5

2X

3.5

2X 1.5

3.05 0.1

A

3.65

3.35

B

4.65

4.35

VQFN - 1 mm max height

RGY0020A

PLASTIC QUAD FLATPACK - NO LEAD

4225320/A 09/2019

PIN 1 INDEX AREA

0.08 C

SEATING PLANE

1

9

12

10

11

20

19

PIN 1 ID

0.1

C A B

0.05

EXPOSED

THERMAL PAD

21

SYMM

SYMM

2

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SCALE 3.000