PM8805 datasheet(41/45 Pages) STMICROELECTRONICS

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DS12813 Rev 1

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PM8805

VFQFPN43 package mechanical data

7.1

Package mechanical data

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

The VFQFPN43L is a custom version of the standard VFQFPN56L 8x8 package, where the

large exposed pad is replaced with 6 exp pads: 4 pads at each corner of the body are

electrically connected to the 4-pair inputs:

EP4 is internally connected with IN12 signal (drain of low-side MOSFET related to pair 1-2

of 1st bridge)

EP3 is internally connected with IN36 signal (drain of low-side MOSFET related to pair 3-6

of 1st bridge)

EP2 is internally connected with IN45 signal (drain of low-side MOSFET related to pair 4-5

of 2nd bridge)

EP1 is internally connected with IN78 signal (drain of low-side MOSFET related to pair 7-8

of 2nd bridge)

while a large, central exp pad is connected to VOB as well as the last exp pad, relevant to

the hot swap circuit:

EP5 is internally connected with VOB signal (drain of 4 high-side MOSFETs of both bridges,

common positive output voltage)

EP6 is internally connected with VOB signal (drain of the hot swap MOSFET)

The VFQFPN43L package is designed in order to guarantee the creepage distance

between signals at different voltage.

PM8805 Scheda tecnica(PDF) 41 Page - STMicroelectronics