TL084MFKB datasheet(11/78 Pages) TI2

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5.6 Thermal Information for Quad Channel

THERMAL METRIC (1)

TL084xx

UNIT

(SOIC)

DYY

(SOT-23)

(TSSOP)

14 PINS

20 PINS

14 PINS

RθJA

Junction-to-ambient thermal

resistance

114.2

153.2

–

128.8

°C/W

Rθ

JC(top)

Junction-to-case (top) thermal

resistance

70.3

88.7

5.61

14.5

–

14.5

56.1

°C/W

RθJB

Junction-to-board thermal

resistance

70.2

65.4

–

127.6

°C/W

ψJT

Junction-to-top

characterization parameter

28.8

9.5

–

°C/W

ψJB

Junction-to-board

characterization parameter

69.8

65.0

–

106.1

°C/W

Rθ

JC(bot)

Junction-to-case (bottom)

thermal resistance

N/A

–

0.5

°C/W

(1)

For information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metric application report.

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TL081, TL081A, TL081B, TL081H

TL082, TL082A, TL082B, TL082H

TL084, TL084A, TL084B, TL084H

SLOS081O – FEBRUARY 1977 – REVISED SEPTEMBER 2025

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