6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Supply voltage: VS = (V+) – (V–)

–0.3

6

V

Input voltage (IN) from (V–) (2)

–0.3

6

V

Input Current (IN)(2)

±10

mA

Output voltage (OUT) from (V-)

TLV4021, TLV4031

–0.3

6

V

TLV4041, TLV4051

–0.3

(V+) + 0.3

V

Output short-circuit duration(3)

10

s

Junction temperature, TJ

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

Input terminals are diode-clamped to (V–). Input signals that can swing more than 0.3 V below (V–) must be current-limited to 10 mA or

less.

In addition, IN can be greater than (V+) and OUT as long as it is within the –0.3 V to 6 V range. Input signals that can swing beyond

this range must be current-limited to 10 mA or less.

(3)

Short-circuit to ground.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage: VS = (V+) – (V–)

1.6

5.5

V

Ambient temperature, TA

–40

125

°C

6.4 Thermal Information

THERMAL METRIC (1)

TLV40x1

UNIT

YKA (DSBGA)

SOT-23 (DBV)

4 BUMPS

5 PINS

RθJA

Junction-to-ambient thermal resistance

205.5

181.7

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

1.8

101.1

°C/W

RθJB

Junction-to-board thermal resistance

75.3

52.0

°C/W

ψJT

Junction-to-top characterization parameter

0.9

28.2

°C/W

ψJB

Junction-to-board characterization parameter

74.7

51.6

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

www.ti.com

TLV4021, TLV4031, TLV4041, TLV4051

SNVSB04C – MARCH 2019 – REVISED DECEMBER 2021

Copyright © 2021 Texas Instruments Incorporated

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