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TPS16632RGET.A Scheda tecnica(PDF) 44 Page - Texas Instruments |
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TPS16632RGET.A Scheda tecnica(HTML) 44 Page - Texas Instruments |
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44 / 46 page ![]() NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271) . 5. Solder mask tolerances between and around signal pads can vary based on board fabrication site. EXAMPLE BOARD LAYOUT 4219016 / A 08/2017 www.ti.com VQFN - 1 mm max height RGE0024H PLASTIC QUAD FLATPACK- NO LEAD SYMM SYMM LAND PATTERN EXAMPLE SCALE: 20X 2X (1.1) 2X(1.1) (3.825) (3.825) ( 2.7) 1 6 7 12 13 18 19 24 25 24X (0.58) 24X (0.24) 20X (0.5) (R0.05) TYP SOLDER MASK DETAILS NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED 0.07 MAX ALL AROUND 0.07 MIN ALL AROUND METAL SOLDER MASK OPENING SOLDER MASK OPENING METAL UNDER SOLDER MASK |
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