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BAT54SWFILM Scheda tecnica(PDF) 4 Page - STMicroelectronics |
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BAT54SWFILM Scheda tecnica(HTML) 4 Page - STMicroelectronics |
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4 / 15 page ![]() Characteristics BAT54 4/15 DocID5505 Rev 12 Figure 7. Thermal resistance junction to ambient versus copper surface under each lead (SOD323) Figure 8. Relative variation of thermal impedance junction to ambient versus pulse duration (SOD323) 200 300 400 500 600 0 5 10 15 20 25 30 35 40 45 50 R th(j-a)(°C/W) Epoxy FR4 e CU=35 µm SCU(mm²) 1.E-03 1.E-02 1.E-01 1.E+00 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Z th(j-a)/Rth(j-a) Single pulse SOD323 Epoxy FR4 S CU=2.25 mm² e CU=35 µm tP(s) Figure 9. Relative variation of thermal impedance junction to ambient versus pulse duration (SOT23) Figure 10. Relative variation of thermal impedance junction to ambient versus pulse duration (SOD-523) 1.E-02 1.E-01 1.E+00 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 Z th(j-a)/Rth(j-a) Alumine substrate 10 x 8 x 0.5 mm Single pulse SOT23 tP(s) 1.E-03 1.E-02 1.E-01 1.E+00 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 Z th(j-a)/Rth(j-a) Single pulse SOD523 Epoxy FR4 e CU=35 µm tP(s) |
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