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ADRF5448BCZ Scheda tecnica(PDF) 12 Page - Analog Devices

Il numero della parte ADRF5448BCZ
Spiegazioni elettronici  Die on Carrier, Silicon SP4T Switch, Nonreflective, 100 MHz to 45 GHz
PDF  14 Pages
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Produttore elettronici  AD [Analog Devices]
Homepage  http://www.analog.com
Logo AD - Analog Devices

ADRF5448BCZ Scheda tecnica(HTML) 12 Page - Analog Devices

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Data Sheet
ADRF5448
THEORY OF OPERATION
analog.com
Rev. 0 | 12 of 14
The ADRF5448 integrates a driver to perform the logic function
internally and to provide the advantage of a simplified control
interface. The driver features four digital control input pads (V1, V2,
EN, and LS) that control the state of the RF paths, determining
which RF port is in the insertion loss state and which RF port is in
the isolation state, see Table 6.
The LS pad allows the user to define the control input logic se-
quence for the RF path selections. The logic level applied to the V1
and V2 pads determines which RF port is in the insertion loss state
while the other three paths are in the isolation state.
When the EN pad is logic high, all four RF paths are in an isolation
state regardless of the logic state of LS, V1, and V2. The RF
ports are terminated to internal 50 Ω resistors, and RFC becomes
reflective.
RF INPUT AND OUTPUT
All of the RF ports (RFC, RF1 to RF4) are DC-coupled to 0 V,
and no DC blocking is required at the RF ports when the RF line
potential is equal to 0 V.
The RF ports are internally matched to 50 Ω. Therefore, external
matching networks are not required.
The insertion loss path conducts the RF signal between the RF
common port and the selected RF throw port. The switch design is
bidirectional with equal power handling capabilities. The RF input
signal can be applied to the RF common port or the selected
RF throw port. The isolation paths provide high loss between the
insertion loss path and the unselected RF throw ports that are
terminated to internal 50 Ω resistors.
POWER SUPPLY
The ADRF5448 requires a positive supply voltage applied to the
VDD pad and a negative supply voltage applied to the VSS pad.
Bypassing capacitors are recommended on the supply lines to filter
high frequency noise.
The power-up sequence is as follows:
1. Connect to GND.
2. Power up VDD and VSS. Power up VSS after VDD to avoid
current transients on VDD during ramp up.
3. Power up the digital control inputs. The order of the digital
control inputs is not important. However, powering the digital
control inputs before the VDD voltage supply can inadvertently
forward bias and damage the internal ESD structures. To avoid
this damage, use a series 1 kΩ resistor to limit the current
flowing into the control pad. Use pull-up or pull-down resistors
if the controller output is in a high impedance state after VDD is
powered up, and the control pads are not driven to a valid logic
state.
4. Apply the RF signal.
The power-down sequence is the reverse order of the power-up
sequence.
Table 6. Control Voltage Truth Table
Digital Control Inputs
RFx Paths
EN
LS
V1
V2
RF1 to RFC
RF2 to RFC
RF3 to RFC
RF4 to RFC
Low
Low
Low
Low
Insertion loss (on)
Isolation (off)
Isolation (off)
Isolation (off)
Low
Low
High
Low
Isolation (off)
Insertion loss (on)
Isolation (off)
Isolation (off)
Low
Low
Low
High
Isolation (off)
Isolation (off)
Insertion loss (on)
Isolation (off)
Low
Low
High
High
Isolation (off)
Isolation (off)
Isolation (off)
Insertion loss (on)
Low
High
Low
Low
Isolation (off)
Isolation (off)
Isolation (off)
Insertion loss (on)
Low
High
High
Low
Isolation (off)
Isolation (off)
Insertion loss (on)
Isolation (off)
Low
High
Low
High
Isolation (off)
Insertion loss (on)
Isolation (off)
Isolation (off)
Low
High
High
High
Insertion loss (on)
Isolation (off)
Isolation (off)
Isolation (off)
High
Low or high Low or high Low or high Isolation (off)
Isolation (off)
Isolation (off)
Isolation (off)



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