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M2TP80M12W2-2LA Scheda tecnica(PDF) 2 Page - STMicroelectronics |
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M2TP80M12W2-2LA Scheda tecnica(HTML) 2 Page - STMicroelectronics |
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2 / 14 page ![]() 1 SiC Power MOSFET (Q1, Q2, Q3, Q4, Q5, Q6) Table 1. Absolute maximum ratings Symbol Parameter Value Unit V(BR)DSS Drain-source breakdown voltage 1200 V VGS Gate-source voltage -10 to 22 V Gate-source voltage (recommended operating values) -5 to 18 ID Drain current (continuous) at TC = 50 °C 30 A IDM(1) Drain current (pulsed, tp = 1 ms) 58 A TJ Operating junction temperature range -40 to 175 °C 1. Pulse width is limited by safe operating area. Table 2. Electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit RDS(on) Static drain-source on resistance VGS = 18 V, ID = 20 A 84 114 mΩ VGS = 18 V, ID = 20 A TJ = 175 °C 178 VGS(th) Gate threshold voltage VDS = VGS, ID = 1 mA 1.9 3.2 5 V IDSS Zero gate voltage drain current VGS = 0 V, VDS = 1200 V 10 µA IGSS Gate-body leakage current VDS = 0 V, VGS = -10 to 22 V ±100 nA Ciss Input capacitance VDS = 800 V, f = 1 MHz, VGS = 0 V 1230 pF Coss Output capacitance 56 pF Crss Reverse transfer capacitance 15 pF RG Intrinsic gate resistance f = 1 MHz open drain 1 Ω Qg Total gate charge VDD = 800 V, ID = 20 A, VGS = -5 to 18 V 63 nC Qgs Gate-source charge 15 nC Qgd Gate-drain charge 20 nC Eon Turn-on switching energy VDS = 800 V, ID = 20 A, RG(on) = 12 Ω, RG(off) = 5.6 Ω, VGS = -5 to 18 V 374 µJ Eoff Turn-off switching energy 64 µJ RthJC Thermal resistance, junction-to-case 0.54 °C/W Table 3. Reverse intrinsic SiC diode characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit VSD Forward on voltage drop VGS = 0 V, ISD = 20 A - 3.4 - V trr Reverse recovery time ISD = 20 A, VDD = 800 V, RG(on) = 12 Ω, RG(off) = 5.6 Ω - 14.1 - ns Qrr Reverse recovery charge - 163 - nC IIRRM Reverse recovery current - 19 - A M2TP80M12W2-2LA SiC Power MOSFET (Q1, Q2, Q3, Q4, Q5, Q6) DS14474 - Rev 3 page 2/14 |
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